Qianli 3D BGA Reballing Stencil Platform for Phone X/XS/MAX 11 Pro Max Motherboard Middle Layer Planting Tin Template Plate Net

$26.99

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SKU: 1712972 Category:
Description:
QianLi 3 IN 1 phone Middle Frame Reballing Platform for phone X XS MAX 11 11 Pro 11 Pro Max motherboard soldering tool, QianLi phone Middle Frame Reballing Platform for phone X XS MAX 11 11 Pro 11 Pro Max  logic board dissembling and assembling testing tool.
QianLi Middle Frame Reballing Platform for phone X XS MAX 11 11 Pro 11 Pro Max  Separating 
 
Features:
Stencils won’t deform under high temperature.
Featured material.
Strong Magnetic attraction.
Precise positioning.
Efficiency Improvement.
Unique design.
Durable.
Package Included:
1 x Qianli 3D BGA Reballing Stencil Platform 

Detail Pictures:

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Qianli 3D BGA Reballing Stencil Platform for Phone X/XS/MAX 11 Pro Max Motherboard Middle Layer Planting Tin Template Plate Net
Qianli 3D BGA Reballing Stencil Platform for Phone X/XS/MAX 11 Pro Max Motherboard Middle Layer Planting Tin Template Plate Net

$26.99

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